
Through hole: Φ0.25mm ( half hole through on the edge)
Surface technology: Plating Ni/Cu
Four-layer Board: Thickness: 1.6mm
Copper thickness: 2OZ
Line width/line space: 5mil/5mil
Through hole: Φ0.3mm
Surface technology: Lead-free OSP
Double-sided Board:Thickness: 1.6mm Solder mask material (Red)
(Used as the computer’s accessories)
Surface technology: Plating Ni/Cu

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